Bostik Thermogrip H1714 Overview
H1714 is a low application temperature hot melt adhesive for case forming and sealing applications. H1714 is a product specifically designed to provide very low application temperatures (250°F to 275°F) while still providing fiber-tearing bonds over a wide temperature range on a variety of substrates.
Key Features
- Low application temperature
- Clean running
- Fiber tearing bonds on a variety of board stocks
